CHINAPLAS2017 to present lightweight packaging solutions from industrial leaders

▲The enhanced expandedpolyethylene (EPE) foam solution developed by Dow gives high level of cushion performance and abuse resistance.

The enhancedexpanded polyethylene (EPE) foam solution developedby Dow gives high level of cushion performance andabuse resistance. With tailored LDPE/LLDPE blends and exceptional processability, thisnew foam solution achieves new levels of down weighting and downgauging. Savingsup to 15% can be made on raw material costs in unit packaging while providingthe same or better protective performance.

In addition, UROLA will be displayinga ROTARY extrusion blown moulding machine which can produce bottles from HDPE(High Density Polyethylene). Bottles produced have a very high consistency, with weight reduction averaging to5% and energy consumptiondecreased by 30%. This technology produces minimum material wastes and occupies very little floorspace without compromise in surface finish, material distribution and consistency.

High barrier film and multi-layer co-extrusion technology in CHINAPLAS 2017

▲ Theunique additiveBYKO2BLOCK-1200 developed by BYK can achieve a significant improvement in theimpermeabilityof film. 

BYK will be launchingits newly-developed unique additive BYKO2BLOCK-1200 in CHINAPLAS 2017. This additiveis based on platelet-forming modified clay and was developed especially for usein food packaging films. The separated platelets are distributed equally in thepolymer matrix, thereby reducing the permeability to gases and water vapour. A small quantity of the additive can lead to a significant improvement in the barrierproperty while maintaining stable mechanical properties and transparency.Moreover, it can also improve heat deformability.

The PODtechnology, developed by MACCHI SPA, which willbe launched in CHINAPLAS 2017, allows for the production of better, thinner, stronger and cheaper multi-layer PE films. The five-layer structure materials have excellent opticalperformance and can improve appearance and sealing properties. The secondary sandwich layer materialscan provide higher mechanicalstrength and allow easydowngauging.

CHINAPLAS2017 to showcase biodegradable plastics in a kaleidoscope ofapplications

▲ Taikang POF(polyolefin) heat shrink films, developed by Shandong Taikang Biodegradable Packing Materials Co. Ltd., will debut in the upcomingCHINAPLAS.

Taikang POF (polyolefin) heat shrink films, developed by Shandong Taikang Biodegradable PackingMaterials Co. Ltd., will debut in the upcoming CHINAPLAS. It is currently one of the mostadvanced environmental friendly plastic packaging materials with higher tearingsound toughness and high anti-impact strength.

REVERDIA will showcase its biosuccinium succinic acid inCHINAPLAS 2017. Biosuccinium is the first non-fossil feedstock derived chemicalbuilding block that allows customers in the chemical industry to choose abio-based alternative with a lower eco-footprint for a broad range ofapplications, from packaging to footwear.

Poly propylene carbonate(PPC),developed by Jilin Boda Oriental New MaterialCo., Ltd., is a biodegradable plastic resin of recycled greenhouse gas CO₂, andis prepared by polymerization using carbon dioxide and propylene oxide. It can find uses in a wide variety of plastic marketsto replace traditional resins such as PE, PP and PA, providing a new and comprehensive solution to sustainability and plastic pollution worldwide.

Professionals from upstream and downstream industries join forces for the future of packaging industry

So far, several leadingsuppliers from packagingindustry have confirmed to exhibit in CHINAPLAS 2017, including BASF, DuPont, Dow, Mitsubishi Chemical, Kingfa, Kuraray, Milliken, Clariant, NatureWorks, Arburg, Engel, Tech-long, Han King, Jinming,Jwell etc. Meanwhile, a vast number of leading end-user enterprises have pre-registered to visit CHINAPLAS 2017, including Danone, Coca Cola, P&G, Colgate, Amway,Essel Propack, Bemis, to name but a few.

In addition to the cutting edge exhibits on the show floor, the organizerwill also hold three concurrent events: the “2^nd Industry4.0 Conference”, “Designx Innovation” and the “3^rdMedical Plastics Conference”. What is noteworthy is thatthe “Packaging4.0 Technology Seminar” will be held in the “2^nd Industry4.0 Conference” and it will bring advanced technologies in line with Industry4.0 to the packaging industry. Moreover, technical seminars such as “ChinaBlister Industry Technology Summit Forum”, “Barrie Property of Food ContactMaterials Seminar”will also be presented for local and overseas visitors.

One-daypasses can be purchased at RMB 30 each, while four-day passes cost RMB 50 each.To enjoy free admission, please pre-register on or before May 9, 2017 at www.ChinaplasOnline.com/prereg. For more information onCHINAPLAS 2017, please visit www.ChinaplasOnline.com.